Tech Joo Goh
Teck Joo Goh is a visionary technology strategist and global ecosystem builder with 25+ year track record of transforming enterprises through cutting-edge AI/ML adoption, cloud infrastructure innovation, and semiconductor-hardware co-design. Currently serving as Principal at SkyeChip, he leads the company’s aggressive expansion into the Americas and EMEA, architecting partnerships with AI-first startups, hyperscalers (AWS, Azure, GCP), and semiconductor innovators to accelerate custom ASIC/IP licensing for next-gen AI & high performance computing (HPC) workloads. His work focuses on bridging the gap between AI software demands and hardware efficiency, particularly in edge computing and energy-constrained environments.
As Principal at LINK Business Silicon Valley, Teck advises private equity and venture capital firms on Semiconductors, GenAI adoption, cloud migration, and infrastructure modernization, driving premium valuations (15-25% above market) for portfolio companies. He architects partnerships between hyperscalers, Fortune 500 innovators, and startups, facilitating high-impact tech transactions and exits. His thought leadership on AI/cloud M&A trends, cited across 10+ industry platforms, shapes Silicon Valley’s investment landscape, while his mentorship on technical due diligence—such as cloud cost optimization and AI ROI frameworks—strengthens portfolio resilience.
Prior to SkyeChip and LINK, Teck revolutionized Intel’s AI strategy as General Manager of Global AI Ecosystem
& Partnerships, where he:
• Tripled cloud/AI revenue to $700M+ in 18 months by pioneering SaaS/IaaS/PaaS models and hyperscaler alliances.
• Co-founded the Open Platform for Enterprise AI (OPEA), establishing industry standards for secure, interoperable AI infrastructure.
• Drove adoption of Intel’s AI solutions across 50+ Fortune 500 enterprises, including joint cloud-native platforms with AWS and Azure.
A trusted C-suite advisor, Teck has shaped $3B+ revenue streams for Fortune 500 firms and PE/VC portfolios by modernizing infrastructure, reducing technical debt, and aligning AI roadmaps with market demands. His technical acumen is rooted in semiconductor innovation—he directed Intel’s $2B Data Center & AI R&D programs, launching award-winning products like the RealSense™ 3D camera and Classmate PC, and holds patents in AI-optimized hardware, FaaS systems, and Edge computing security.
Academic rigor underpins his leadership: A PhD in Engineering and MBA inform his unique ability to merge deep technical insights with scalable business models. His thought leadership—40+ peer-reviewed publications on microelectronics and AI infrastructure—has shaped Silicon Valley’s tech transaction landscape, while his fluency in English, Mandarin, Malay, and Bahasa Indonesia enables cross-border collaboration with APAC and EMEA markets.
Today, Teck is at the forefront of democratizing AI for SMBs, advocating for offline LLM-as-a-service solutions, and advancing custom silicon for AI acceleration. His work with SkyeChip’s Network-on-Chip (NoC) IP and ASIC design wins exemplifies his commitment to solving compute bottlenecks for generative AI and real-time inference, positioning him as a catalyst for the next wave of AI-hardware synergy.